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Technical Road Map

PCB Technology Road Map
Items 2020 2021 2022
max layer 62 66 70
max board size 600*1500mm 600*1500mm 600*1500mm
max board thickness 10.0mm 10.0mm 10.0mm
min board thickness 0.05mm 0.05mm 0.05mm
max finished copper thickness 13 OZ 13 OZ 13 OZ
min track/gap 50/50UM 30/30UM 15/15UM
min mechanical hole 0.15mm 0.15mm 0.15mm
min laser hole 0.075mm 0.075mm 0.075mm
aspect ratio 18:01 20:01 22:01
impedance tolerance +/-10% +/-8% +/-5%
HDI capability any layer any layer any layer
flexible PCB mass production mass production mass production
rigid {{{14|||flex PCB}}} mass production mass production mass production
IC Substrates mass production mass production mass production
Special technologies Tenting, Etch Back,Buss-less Tenting, Etch Back,Buss-less,MSAP,SAP Tenting, Etch Back,Buss-less,MSAP

 

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IC Substrates