| Items | 2020 | 2021 | 2022 |
| max layer | 62 | 66 | 70 |
| max board size | 600*1500mm | 600*1500mm | 600*1500mm |
| max board thickness | 10.0mm | 10.0mm | 10.0mm |
| min board thickness | 0.05mm | 0.05mm | 0.05mm |
| max finished copper thickness | 13 OZ | 13 OZ | 13 OZ |
| min track/gap | 50/50UM | 30/30UM | 15/15UM |
| min mechanical hole | 0.15mm | 0.15mm | 0.15mm |
| min laser hole | 0.075mm | 0.075mm | 0.075mm |
| aspect ratio | 18:01 | 20:01 | 22:01 |
| impedance tolerance | +/-10% | +/-8% | +/-5% |
| HDI capability | any layer | any layer | any layer |
| flexible PCB | mass production | mass production | mass production |
| rigid {{{14|||flex PCB}}} | mass production | mass production | mass production |
| IC Substrates | mass production | mass production | mass production |
| Special technologies | Tenting, Etch Back,Buss-less | Tenting, Etch Back,Buss-less,MSAP,SAP | Tenting, Etch Back,Buss-less,MSAP |
