Rigid PCB

 Items

 Technology capability

 Layer count

 1-46 layer

 Max manufacturing size       

 1-2 layer 

 600mm*1500mm

 Multilayer

 530mm*900mm

 Board thickness

 0.05mm—10.0mm

 Copper foil thickness                

 0.25OZ-13OZ

 Min line width/space                 

 2.5 mil / 2.5 mil

 Outline tolerance 

 Punching

 +/-0.15mm

 Routing

 +/-0.10mm

 Min hole

 Mechanical

 0.15mm

 laser

 0.075mm

 Impedance control tolerance      

 +/-8%

 Aspect ratio

 18:01

 Surface treatment

 Immersion Gold(ENIG), Immersion Tin, Immersion Silver, Gold Fingers, ENEPIG,Flash Gold, Hard  Gold(max Au>3UM), Wire bondable soft gold, lead free HASL, HASL, OSP...

 Material Types

 TG135, TG150, TG180, TG200, TG250; FR4,Polymide, High frequency (RO435B,  RO4003C,RO4450F, RT5880, RO3003, F4BM…)

 Materials suppliers

 Shengyi,ITEQ,Rogers,Panasonic,TUC,KB, Berguist…