IC Substrates

  1. Home
  2. Technology
  3. IC Substrates

IC Substrates

IC Substrates Design Rulers

SN Category Items Capability
1 Stack up layer 2-18 layer
2 final thickness 0.1-3.2mm
3 core thickness maximum core 1.5mm
4 minimum core 0.05mm
5 Vias laser via minimum via φ0.05mm
6 minimum PAD for laser via φ0.1mm
7 aspect ratio 0.9：1
8 Dimple for via on PAD ≦5um
9 machnical via minimum via φ0.1mm
10 minimum PAD for machnical via φ0.2mm
11 plugging via with resin  aspect ratio 30:1
12 copper height thickness  R≦5um
13 copper thickness in hole copper thickness on hole wall ≧5um
14 Trace and gap for conductive minimum trace/gap final copper thickness 10um 0.03mm
15 final copper thickness 16um 0.04mm
16 final copper thickness 20um 0.05mm
17 final copper thickness 25um 0.06mm
18 final copper thickness 35um 0.1mm
19 PAD minimum PADs gap Tenting  0.04mm
20 PAD dimesion tolerance ±0.03mm
21 minimum PAD SMD/NSMD 0.15mm
22 Solder mask solder mask registration tolerance 0.015mm
23 solder mask types black color by D/F & W/F  black color by W/F---print-oven dry-exposure-developing  
black color by D/F--lamination-exposure-developing
24 solder mask dam 0.075mm
25 minimum defined PAD  0.20mm
26 solder mask thickness 15-25um
27 Undercut ≦30um
28 Dimesion mininum telorance  ±0.05mm
29 Testing testing points two lines testing two line testing, 4 line testing
30 minimum test pad size (L*W) two line 55um（min);  4 line 100um（min)
31 measurement efficiency 2 line 2000-3000points/minute；4 line1000-1400/minute
32 Warp & twist standard =<0.75%
33 =<0.75%
34 reflow times 260℃*1 time
35 Flatness room tempreture lowest point to highest point 3-5um
36 Glossy testing angle @60° black：NA   white：standard≧82%,  high reverberate≧90%
37 Outline type milling and laser
38 dimesion tolerance ±0.1mm for milling, +/-0.05 for laser cutting
39 Mini LED pitch pitch P0.9375
40 Surface finished type electroplating nickel gold, electroplating nickel silver, immersion nickel gold, ENEPIG, electroplating nickel silver gold, selective plating gold or silver, electroplating tin, immersion tin, OSP…
41 HDI ranks any layer for 8 layer IC substrates, 5 ranks for PCBs
42 LED specification IF1616-P0.9375 
43 Material Types HL832-NX,MCL-E-679,HL832-NS,750G, DS-7409,FR5, ABF…