Ceramic Substrates
Part No.: E0298060329A
Layer count: 2 layer
Material: Ceramics + 8 OZ Copper
Minimum trace: >100 mil
Minimum space(gap): 100 mil
Minimum hole: N/A
Surface finished: immersion gold Au >3U"
Unit size 13.5*15.5mm
Ceramic Substrates Advantages:
* High thermal conductivity, 20-200 W/M*K , 20 to 200 times higher than standard matal core PCB. Withstand voltage 17000V/MM, 17 time higher than other standard PCBs.
* Peelable strength >=20N/CM2, the harshness 0.20 to 0.70um for ceramics surface.
* Compressive strength >=450MPa, bigger than any other PCB raw material, and good performance in severe environment ( high temperature, high humidity and high corrosive)
Automotive Industry