BT, FR5, IC Substrates

Leading of DDR IC Substrates Manufacturing in China, up to 8 layer DDR IC substrates are available for High Quality PCB.

IC Substrates for BGA, The full name of BGA is Ball Grid Array, which literally means grid array packaging.

IC Substrates for MEMS, MEMS sensors, namely micro-electro mechanical systems, are interdisciplinary frontier research fields developed on

IC Substrates for Trans-flash Card or Micro SD Card. Micro SD Card, formerly known as Trans-flash Card (TF card), was officially renamed Micro SD Card in 2004.

Leading of IC substrates manufacturer in China since 2006, up to 8 layer, min trace/gap 15um projects are available for High Quality PCB.

A Leading of IC Substrates Manufacturing in China since 2006, High Quality PCB Co., Limited, MEMS is one of our IC substrates projects.

High Quality PCB Co., Limited is a leading of IC substrate manufacturing in China since 1995.

High Quality PCB Co., Limited is a leading of PCB manufacturer in China since 2006, up to 18 layers IC substrates is available.