micro via PCB | multilayer PCB
micro via PCB, multilayer PCB
Layer count: 6 HDI PCB
Material: FR4 , 0.6mm, high TG, 0.5 OZ for all layer
Minimum tack: 3 mil
Minimum space(gap): 3 mil
Minimum hole: 0.15mm
Surface finished: ENIG
Panel size: 220*268mm/16up
Application: Communications devise
Characteristics: high density interconnect PCB, via on pad(plug with resin, copper capping), high TG, thin core 3mil thickness
high density interconnect PCB, via on pad(plug with resin, copper capping), high TG, thin core 3mil thickness
Communications facilities