micro via PCB, multilayer PCB

Layer count: 6 HDI PCB
Material: FR4 , 0.6mm, high TG, 0.5 OZ  for all layer
Minimum tack: 3 mil
Minimum space(gap): 3 mil
Minimum hole: 0.15mm
Surface finished: ENIG
Panel size: 220*268mm/16up

Application: Communications devise
Characteristics: high density interconnect PCB, via on pad(plug with resin, copper capping), high TG, thin core 3mil thickness