Rozwój możliwości technicznych

Items	2015	2016	2017
max layer	42	46	48
max board size	600*1000mm	600*1000mm	600*1000mm
max board thickness	10.0mm	10.0mm	10.0mm
min board thickness	0.05mm	0.05mm	0.05mm
max finished copper thickness	13 OZ	13 OZ	13 OZ
min track/gap	50/50UM	30/30UM	15/15UM
min mechanical hole	0.15mm	0.15mm	0.15mm
min laser hole	0.075mm	0.075mm	0.075mm
aspect ratio	18:01	18:01	18:01
impedance tolerance	+/-8%	+/-5%	+/-5%
HDI capability	4+N+4	6+N+6	any layer
flexible PCB	mass production	mass production	mass production
rigid flex PCB	mass production	mass production	mass production
IC Substrates	mass production	mass production	mass production
Special technologies	Tenting, Etch Back,Buss-less	Tenting, Etch Back,Buss-less,MSAP,SAP	Tenting, Etch Back,Buss-less,MSAP