Keywords: PCBA China, PCBA Assembly China

One of the frequently misunderstood but most important elements in mind is designing with PCBA China. Helping you become a designing pro, this series is dedicated. Ensuring a smooth quick turn PCB production process, PCB design has been optimized on the first try. This ensures a smooth process of the quick-turn production process. Follow these tips when you design for assembly.

Design for assembly

Let’s discuss what board assembly entails before going any further. Its high density and flex interconnect (HDI), or otherwise, is fabricated after a board design is submitted and approved. With additional components, the bare boards will need to be assembled once that is complete including memory and processors.

Simple enough: among those who are not yet PCB Experts, often the emerging problem is that the assembly is not completely taken into account by the initial circuit board design. Instead, on the board itself, they focus exclusively without a broader context of how within the application or product, the board will be used.

Significant complications can emerge from overlooking board assembly. When viewed in isolation, a circuit board design may seem perfectly acceptable but assembly is made difficult later on by certain design decisions. For example, to one another, components may be situated too close which could cause performance issues, or lead to a non-functioning product.

Then the component availability question arises. As soon as the boards arrive, the assembly vendor needs to have the requisite components on hand for the board production to progress effectively as a whole and for the circuit board assembly process to flow smoothly. The whole process will be delayed if they aren’t available, undermining the quick turn approach value to board production.

Becoming a PCB assembly master

If you aren’t approaching design with circuit board assembly in mind, those are just some of the issues that will arise. The question is how these mistakes can be avoided by the PCB experts? Here are certain tips.

Focus on part-to-part spacing pay

Regarding component-to-component spacing, one of the frequently asked questions posed by designers who are not yet boarding experts. Various issues which may require re-fabrication and re-design can create by placing a component too close to another component, which results in a loss of money and time.

To avoid part-to-part spacing issues during assembly, Board experts use several techniques. There are always enough gaps between component boundaries and the design of their footprint in such away. Arising from components being too close during placement alleviates any potential issues.

So the place-bound component shapes do not overlap each other, Designers must carefully place components. Keeping the minimum spacing rules in mind, PCB Experts can move components closer to one another and disregard the place-bound shape if the board does not have enough space.

In your design software, you must ensure component proximity, requirements, regulations, and rules have been established. Board experts, for various part types, have specific component-to-component spacing guidelines.

Choosing components in the design phase

In the design process, PCB Experts choose components early realizing that to ensure there are no conflicts between the components being assembled and the actual design, this is the best way. Component sizes and space are no longer a concern if you factor in component sizes from the very beginning, and without barriers, the circuit board assembly process can proceed. This makes way to the next tip.

To see if the component size can be reduced, the board designer should talk to the circuit engineers and designer. This creates additional space on the board. After all, a smaller footprint on the board is indicated by a smaller part.

Separate lead-free from non-lead-free components

With components that are not specified for lead-free PCBA Assembly China, never mix lead-free components. All components must be qualified for lead-free assembly and the entire board must be assembled lead-free if no substitute for conventional leaded solder is available and any component requires lead-free assembly.

Sometimes a lead-free BGA is the only package available for a particular device. However, with conventional leaded solder, boards that will be used for military projects must be assembled as per government requirements typically. To allow lead-free assembly, the designer must obtain a waiver from the customer; in a package for assembly with conventional leaded solder, modify the design to use a device; or for leaded solder, have the BGA rebelled. This is an expensive procedure for damaging parts.

Even the Placement of large components

To achieve the best possible thermal distribution during solder reflow, Distribute large components across a board as evenly as possible during layout. For the reflow oven unique to each assembly job, Make sure the assembly contractor tailors a thermal profile.

Avoid technologies mixing

Avoid mixing technologies whenever possible. For example, the additional money and time spent are not outweighed by the payoff of a single through-hole. To either use multiple through-holes or none, it would be more efficient. Placing all through-holes on one side of the board will reduce manufacturing time if you use through-hole technologies.

Choose the Correct package size

Communication between the board designer and electrical engineer should begin during the early stages of layout. The BOM should be reviewed by the designer and the parts being used in the design is carefully examined. If the current design uses unnecessarily smaller components and there is space on the board, the designer may recommend larger components. During PCB assembly process, this will help avoid complications.

Various vendors also manufacture this. During the assembly process, choosing these components will avoid delays. The option of choosing alternate parts without changing the schematic or layout is given to both the designer and the electrical engineer as a timely solution to components not in stock.

Finally while in the board design phase, choosing the appropriate package size is important. When there is a good reason to, A PCBA China only chooses smaller packages; otherwise, prefers bigger options. Electrical engineers choose unnecessarily small component packages in too many cases. In terms of assembly yield, this can create issues as it is more difficult to rework and touch up smaller components. It may be more cost-effective to completely rebuild the board and the solder and remove new components based on the amount of rework needed.