Keywords; IC Substrates, IC Substrates China

With the booming of new types of ICs like CSP (chip scale package) and BGA (ball grid array), IC substrate has been developing. This needs new package carriers. In both applications and popularity together, IC Substrates PCB has exploded with any layer flex-rigid PCB and HDI PCB as one type of the most advanced PCB (Printed Circuit Board). These are applied in electronics and telecommunications updates.

IC Substrates

Utilized in the packaging of bare integrated circuit chips, IC substrate is a baseboard type. The substrate IC proves important in connecting the circuit board and the chip. Serving to capture semiconductor integrated circuit chip, routing to link the chip with the PCB, as well as reinforcing, supporting, and safeguarding the IC chip, Integrated circuits fall under a transitional product. It offers a tunnel for thermal dissipation too.

As connectors of the printed circuit boards to the semiconductor chip, Integrated circuit substrate plays a crucial role. It plays the role of a conduit. To provide interconnect densities that surpass those of PCB fabricators, it requires capacity on IC fabricators during the manufacturing process of IC substrate. In chemical expertise regarding high-density designs, manufacturers will need a possess proven solutions and specialty consequently. 

Used to package bare IC (integrate circuit) chip, IC substrate is a type of baseboard. IC belongs to an intermediate product with the following functions Connecting circuit board and chip:

• Semiconductor IC chip is captured by it;
• For connecting PCB and chip, there’s routing inside;
• Providing thermal dissipation tunnel, it can support, reinforce and protect IC chip.

Under different classifications Integrated circuit substrates fall and they are very much diverse. We will look at the various types under each class and each classification to comprehend all of this better.

IC Substrates Classifications

Category as per Package attributes

• BGA IC Substrate: In electrical performance and thermal dissipation, this kind of IC Substrate performs well. This can increase chip pins dramatically. Therefore for an IC package with a pin count exceeding 300, it is suitable.
• CSP IC Substrate: With the miniaturized scale and lightweight, CSP is a type of single-chip package. This features a similar size to IC. In electronic products, telecommunication products, and memory products with a small number of pins, CSP IC substrate is mainly used.
• FC IC Substrate: Featuring effective thermal dissipation, low circuit loss, low signal interference, and well-performed performance, FC (Flip Chip) is a type of package by flipping chip.

MCM IC Substrate: Multi-chip module or MCM is a type of IC Substrates China. Chips with different functions are absorbed into one package. Due to its attributes including miniaturization, thinness, lightness, and shortness, the product can be an optimal solution as a result. Naturally, this type of substrate doesn’t perform so well in fine routing, thermal dissipation, signal interference, etc as multiple chips are packaged into one package.

Category as per material attributes

• Rigid IC Substrate: It is made by ABF resin, BT resin, or epoxy resin primarily. Its thermal expansion coefficient is approximately 13 to 17ppm/°C.
• Flex IC Substrate: It features a thermal expansion coefficient of 13 to 27ppm/°C and is primarily made by PE resin or PI.
• Ceramic IC Substrate: By ceramic materials such as silicon carbide, Aluminium nitride, or Aluminium oxide, it is primarily made. Approximately being 6 to 8ppm/°C, It features a relatively low thermal expansion coefficient.

Category as per bonding technology attributes

• FC Bonding
• TAB (Tape Automated Bonding)
• Wire Bonding

IC Substrate PCB Applications

On electronic products having advanced functions, thinness, and lightweight like tablet PC, laptop, smartphones and network in fields of medical care, telecommunications, military, aerospace, and industrial control, IC substrate PCBs are applied mainly.

From substrate-like PCB, traditional HDI PCBs, and multilayer PCB to IC substrate PCBs, Rigid PCBs have followed through a series of innovations. With a similar fabrication process approximately semiconductor scale, SLP is just a type of rigid PCBs.

Manufacturing Process of IC Substrate PCB

Between the IC chip and a printed circuit board, integrated circuit substrate acts as the primary connection. By the network of conductive holes and traces, it accomplishes this.

Manufacturing Steps

• Copper patterning and plating: In the manufacturing process, this is the first step. Correlating to diverse technological aspects like control and circuit compensation technology, fine-line fabrication technology, and uniform control of copper plating thickness, it involves the platting tech and copper patterning.
• Solder mask: It follows the copper plating and patterning process. Solder mask printing and hole filling technologies are present in The solder mask for integrated circuit substrate PCB. Between pad and solder mask, less than ten-micrometer height difference of substrate have been permitted by IC substrate PCBs consistently. However, it is not recommended to allow more than fifteen micrometers.
• Surface finishing: Ensuring a uniform thickness of the surface finish is crucial in this step. The use of ENIG and ENEPIG surface finishes is involved, which are acceptable across the board.
• Reliability tests and Inspection: This is the final step of IC substrate manufacturing. For quality as well as reliability, the integrated circuit substrate has to get inspected here. However, from those utilized in standard printed circuit boards, the technology used in the inspection and testing reliability differs.

However, despite the steps enumerated above, understanding that the manufacturing process of integrated circuit substrate PCB is not straightforward is essential.

IC Packaging

It often comes as the Last Step in semiconductor devices production. At this stage, a casing protecting the integrated circuit from age-related corrosion or detrimental external elements is received by the semiconductor. The casing by design protects the block apart from promoting electrical contacts. This delivers signals to an electronic device’s circuit board.

From the BGA packages of the 1970s, The IC packaging tech evolved when they became popular among the manufacturers of electronic packaging. However, from the onset of the 21st century the fresher options and versions overshadowed pin grid array packages. In such technologies the plastic quad flat pack and small thin outline packages are included. Currently like the FCBGA, more advanced packaging technologies exist. It is an up-gradation of the land grid array packages.

Final Touch

For linking the IC chip and PCB, IC substrates are crucial in electronics. When it is the matter of a faulty or successful IC design for your electronic application, understanding everything about them can become the difference due to this. Therefore when designing your IC Substrates for a better outcome, you must consider the aspects discussed.