Keywords: IC Substrates

The growth of new IC types like BGA (ball grid array) and CSP (chip scale package), which require novel package carriers, has accelerated the development of IC substrates. Along with any layer HDI PCB and flex-rigid PCB, which are now extensively used in telecommunications and electronics upgrades, IC Substrates PCB has experienced an explosion in popularity and applications as one of the most sophisticated PCB (Printed Circuit Board) types.

Describe IC Substrate

A specific kind of baseboard called an IC substrate is used to package bare IC (integrate circuit) chips. The IC, which connects the chip and circuit board, is a middle product having the following features:

• It seizes an IC semiconductor chip
• It can cover, reinforce, and support the IC chip by creating a thermal dissipation tunnel.
• There is routing inside to link the chip to the PCB.

IC Substrate classifications

• IC Substrate for BGA: This type of IC substrate has good electrical and thermal performance and may significantly expand chip pins. As a result, it is appropriate for IC packages with pin counts of more than 300.
• IC Substrate for CSP: A single chip package known as a CSP is lightweight, compact, and has an IC-like size. The principal applications for CSP IC substrates are electronic items with few pins, communications equipment, and memory products.
• Substrate for FC IC: A sort of packaging by flipping a chip called an FC (Flip Chip) has low signal interference, low circuit loss, good performance, and efficient heat dissipation.
• IC Substrate for MCM: The acronym MCM stands for multi-chip module. One package may include many chips with various functions thanks to this kind of IC substrate. As a result, the product's qualities, such as its lightness, thinness, shortness, and miniaturization, might make it an ideal answer. Naturally, this sort of substrate doesn't perform as well in signal interference, heat dissipation, precise routing, etc. as numerous chips are bundled into one package.

In the domains of telecommunications, healthcare, industrial control, aerospace, and the military, IC Substrates PCBs are mostly used on electronic goods that are lightweight, thin, and have advanced functionalities, such as smartphones, laptops, tablet PCs, and networks.

Following the introduction of multilayer PCBs, conventional HDI PCBs, SLP (substrate-like PCBs), and IC substrate PCBs, rigid PCBs have undergone several advancements. SLP is only a kind of stiff PCB with a comparable, roughly semiconductor-scale production method.