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Items |
Technology capability |
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Layer count |
2-36 layer |
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Max board size |
Multilayer |
530mm*730mm |
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Board thickness |
0.05mm—10.0mm |
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Copper foil thickness |
0.25OZ-6OZ |
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Min line width/gap |
2 mil / 2 mil |
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Outline tolerance |
Punching |
+/-0.15mm |
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Routing |
+/-0.10mm |
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Min hole |
Mechanical |
0.15mm |
|
laser |
0.075mm |
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Impedance control tolerance |
+/-10% |
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Aspect ratio |
18:01 |
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Surface treatment |
Immersion Gold(ENIG), Immersion Tin, Immersion Silver, Gold Fingers, ENEPIG,Flash Gold, Hard Gold(max Au>3UM);Wire bondable soft gold,lead free HASL, HASL, OSP… |
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Material Types |
0.5 mil to 4 mil Polymide,FR4, Rogers |
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Materials suppliers |
Shengyi,ITEQ,Rogers,Panasonic,TUC,ThinFlex,Dupont… |
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