IC Substrates

IC Substrates Design Rulers

IC substrates and SLP design rules
SN	Category	Items		Capability
1	Stack up	layer		2-18 layer
2		final thickness		0.1-3.2mm
3		core thickness	maximum core	1.5mm
4		core thickness	minimum core	0.05mm
5	Vias	laser via	minimum via	φ0.05mm
6			minimum PAD for laser via	φ0.1mm
7			aspect ratio	0.9：1
8			Dimple for via on PAD	≦5um
9		machnical via	minimum via	φ0.1mm
10		machnical via	minimum PAD for machnical via	φ0.2mm
11		plugging via with resin	aspect ratio	30:1
12		plugging via with resin	copper height thickness	R≦5um
13		copper thickness in hole	copper thickness on hole wall	≧5um
14	Trace and gap for conductive	minimum trace/gap	final copper thickness 10um	0.03mm
15			final copper thickness 16um	0.04mm
16			final copper thickness 20um	0.05mm
17			final copper thickness 25um	0.06mm
18			final copper thickness 35um	0.1mm
19	PAD	minimum PADs gap	Tenting	0.04mm
20		PAD dimesion tolerance		±0.03mm
21		minimum PAD	SMD/NSMD	0.15mm
22	Solder mask	solder mask registration tolerance		0.015mm
23		solder mask types	black color by D/F & W/F	black color by W/F---print-oven dry-exposure-developing black color by D/F--lamination-exposure-developing
24		solder mask dam		0.075mm
25		minimum defined PAD		0.20mm
26		solder mask thickness		15-25um
27		Undercut		≦30um
28	Dimesion	mininum telorance		±0.05mm
29	Testing	testing points	two lines testing	two line testing, 4 line testing
30		*minimum test pad size (LW)**		two line 55um（min); 4 line 100um（min)
31		measurement efficiency		2 line 2000-3000points/minute；4 line1000-1400/minute
32	Warp & twist	standard		=<0.75%
33		standard		=<0.75%
34		reflow times		*260℃1 time**
35	Flatness	room tempreture	lowest point to highest point	3-5um
36	Glossy	testing angle @60°		black：NA white：standard≧82%, high reverberate≧90%
37	Outline	type		milling and laser
38	Outline	dimesion tolerance		±0.1mm for milling, +/-0.05 for laser cutting
39	Mini LED pitch	pitch		P0.9375
40	Surface finished	type		electroplating nickel gold, electroplating nickel silver, immersion nickel gold, ENEPIG, electroplating nickel silver gold, selective plating gold or silver, electroplating tin, immersion tin, OSP…
41	HDI ranks			any layer for 8 layer IC substrates, 5 ranks for PCBs
42	LED specification			IF1616-P0.9375
43	Material Types			HL832-NX,MCL-E-679,HL832-NS,750G, DS-7409,FR5, ABF…