earphone main board, headphone PCB, ear cup circuits board, headset PCB board, rigid flex PCB

Layer count: 4
Material: FR4 + Polymide,1.6mm, 1 OZ  for all layer
Minimum tack: 3mil
Minimum space(gap): 3mil
Minimum hole: 0.30mm
Surface finished: ENIG( Au 2 U")
Panel size:220*230mm/8up
Characteristics: rigid flex multilayer PCB, earphone main board