HDI PCB | Bluetooth Circuits Board | Headset Boards

HDI PCB | Bluetooth Circuits Board | Headset Boards

Part No.: E0415060771G

Layer count: 4 layer HDI PCB
Material: FR4 TG150
Minimum trace: 3 mil
Minimum space (gap): 3 mil
Minimum hole: 0.15mm
Surface finished: immersion gold
Panel size: 38*10.5mm/1up

Application: bluetooth headset 
Characteristics: HDI, gold plating, 3/3mil trace/gap, mico vias, black solder mask

HDI, gold plating, 3/3mil trace/gap, mico vias, black solder mask

bluetooth headset