micro via PCB | multilayer PCB

micro via PCB | multilayer PCB

micro via PCB, multilayer PCB

Layer count: 6 HDI PCB
Material: FR4 , 0.6mm, high TG, 0.5 OZ  for all layer
Minimum tack: 3 mil
Minimum space(gap): 3 mil
Minimum hole: 0.15mm
Surface finished: ENIG
Panel size: 220*268mm/16up

Application: Communications devise
Characteristics: high density interconnect PCB, via on pad(plug with resin, copper capping), high TG, thin core 3mil thickness

 high density interconnect PCB, via on pad(plug with resin, copper capping), high TG, thin core 3mil thickness

Communications facilities